Cu25W75 Copper Tungsten
Physical Properties of Copper Tungsten (CuW) :
| Composition | : | Tungsten (W) 75% |
| Hardness | : | 94~96HRB / 210HV |
| Density | : | 14.8~15.0g/cm3 |
| Melting Point | : | 3410oC (Tungsten) 1083oC (Copper) |
| Boiling Point | : | 5660oC (Tungsten) 2595oC (Copper) |
| Bending Strength | : | min 885Mpa |
| Solubility in water | : | Insoluble |
| % Volatile by Vol | : | Not Applicable |
| Odour | : | None |
| Electrical Conductivity | : | min 42% IACS |
| Profiles Available | : | Rectangular / Round Bar / Tube / Tapping Electrode |
| Applications |  |
Used extensively in engineering, electrical and electron industries as well as in metallurgy and in aviation. |
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Combining advantageous attributes of high conductivity of copper and low expansive property of tungsten, it is highly suitable for use in dense circuits and high voltage electrical devices, heat sinks, electrical contacts and electrodes. |
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Widely used in chip carriers, substrates, flanges and frames for power semiconductor devices. |